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 19-1819; Rev 2; 10/04
Low-Cost, Remote SOT Temperature Switches
General Description
The MAX6511/MAX6512/MAX6513 are fully integrated, remote temperature switches that use an external P-N junction (typically a diode-connected transistor) as the sensing element to measure the remote temperature. These devices assert a logic signal when the temperature crosses a factory-programmed threshold. Available trip thresholds are from +45C to +125C in 10C increments. Accuracy is within 3C (TA = -5C to +55C) or 5C (TA = -40C to +85C). Hysteresis is pin selectable to 5C or 10C. The MAX6511 has an active-low CMOS output and the MAX6513 has an active-high CMOS output. The MAX6512 has an open-drain output. The output is asserted when the temperature exceeds the threshold value. The active-low open-drain output is intended to interface with a microprocessor (P) reset or interrupt input. The active-high CMOS output can directly drive a power FET to control a cooling fan. The MAX6511/MAX6512/MAX6513 operate from a +3.0V to +5.5V supply and typically consume 400A of supply current. They are available in the small 6-pin SOT23. The MAX6513 is also available in a 6-pin leadfree TDFN package.
Features
Continuously Measure External Junction Temperature Factory-Programmed Temperature Threshold from +45C to +125C in 10C Increments Insensitive to Series Parasitic Resistance Active-Low CMOS Output (MAX6511) or Open-Drain Output for Overtemperature Alarm (MAX6512) or Active-High Output (MAX6513) for Direct Fan Control <100ms Response Time Accuracy 3C (TREMOTE = +45C to +125C, TA = -5C to +55C) 5C (TREMOTE = +45C to +125C, TA = -40C to +85C) Pin-Selectable 5C or 10C Hysteresis 400A Average Current Consumption +3.0V to +5.5V Supply Range 6-Pin SOT23 Package 6-Pin TDFN Package (Lead Free)
MAX6511/MAX6512/MAX6513
________________________Applications
CPU Temperature Monitoring in High-Speed Computers Multichip Modules Battery Packs Temperature Control Temperature Alarms Fan Control
PART* MAX6511UT_ _ _ -T MAX6512UT_ _ _ -T MAX6513_T_ _ _ -T
Ordering Information
TEMP RANGE PINOUTPUT PACKAGE CMOS (active low)
-40C to +85C 6 SOT23-6
-40C to +85C 6 SOT23-6 Open-drain -40C to +85C 6 TDFN CMOS -40C to +85C 6 SOT23-6 (active high)
Pin Configuration
TOP VIEW
VDD 1 6 DXP
*These parts are offered in nine standard temperature versions with a minimum order of 2500 pieces. To complete the suffix information, select an available trip point in degrees centigrade from the device marking codes table. For example, the MAX6511UT065-T describes a MAX6511 in a 6-pin SOT23 package with a +65C threshold.
GND 2
MAX6511 MAX6512 MAX6513
5
DXN
HYST 3
4
TOVER (TOVER)
( ) ARE FOR MAX6513 SOT23 ONLY.
Typical Operating Circuit appears at end of data sheet. ________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
Low-Cost, Remote SOT Temperature Switches MAX6511/MAX6512/MAX6513
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VDD) ...............................................-0.3V to +6V DXP, DXN, HYST, TOVER (MAX6513), TOVER (MAX6511/MAX6512) ................-0.3V to (VDD + 0.3V) TOVER (MAX6513), TOVER (MAX6511) Output Current ....................................................-1mA/+50mA DXN Input Current...................................................-1mA/+50mA Current (all other pins)......................................................20mA Continuous Power Dissipation (TA = +70C) 6-Pin SOT23-6 (derate 9.1mW/C above +70C) ........727mW 6-Pin TDFN (derate 24.4mW/C above +70C) .........1951mW Operating Temperature Range ...........................-40C to +85C Storage Temperature Range .............................-65C to +150C Junction Temperature ......................................................+150C Lead Temperature Vapor Phase (60s) .......................................................+215C Infrared (15s) ...............................................................+220C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +3.0V to +5.5V, CS = 2200pF, TA = -40C to +85C, TREMOTE = +45C to +125C (Note 1), unless otherwise noted. Typical values are at TA = +25C.) (Note 2)
PARAMETER Supply Voltage Range Supply Current Temperature Threshold Accuracy (Note 3) Power-Supply Sensitivity for Temperature Trip Point Temperature Threshold Hysteresis Response Time Input Voltage High Input Voltage Low Output Voltage High Output Voltage Low Maximum DXP Source Current Minimum DXP Source Current VIH VIL VOH VOL MAX6511/MAX6513, IOUT = 1mA IOUT = 1mA 0.4V VDXP 2V, DXN = GND 0.4V VDXP 2V, DXN = GND 270 9 VDD - 0.2 0.2 VDD 0.2 0.2 THYST HYST = VIL HYST = VIH SYMBOL VDD IDD TTH TA = -5C to +55C TA = -40C to +85C -3.0 -5.0 -0.6 5 10 70 120 CONDITIONS MIN 3.0 400 TYP MAX 5.5 600 +3.0 +5.0 UNITS V A C C/V C ms V V V V A A
Note 1: TREMOTE refers to the temperature of the remote-sensing junction. TA refers to the temperature of the MAX6511/MAX6512/ MAX6513 package. Note 2: All parameters are 100% production tested at TA = +25C. Specifications over temperature limits are guaranteed by design. Note 3: This parameter is guaranteed by design to 3.5 sigma.
2
_______________________________________________________________________________________
Low-Cost, Remote SOT Temperature Switches MAX6511/MAX6512/MAX6513
Typical Operating Characteristics
(VDD = +3.3V, CS = 2200pF, TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. AMBIENT TEMPERATURE
MAX6511 toc01
TEMPERATURE TRIP THRESHOLD ERROR vs. AMBIENT TEMPERATURE TA
MAX6511 toc02
TEMPERATURE TRIP THRESHOLD ERROR vs. CS CAPACITANCE
TEMPERATURE TRIP THRESHOLD ERROR (C) 12 10 8 6 4 2 0 -2 -4 0 10 20 30 40 50 60
MAX6511 toc03
TEMPERATURE TRIP THRESHOLD ERROR (C)
440 420 SUPPLY CURRENT (A) 400 380 360 340 320 300 -40 -15 10 35 60 (NOTE: SUPPLY CURRENT INCLUDES EXTERNAL DIODE-CONNECTED TRANSISTOR)
0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -60 -40 -20 0
14
85
20 40 60 80 100 120 140
AMBIENT TEMPERATURE TA (C)
AMBIENT TEMPERATURE TA (C)
CS CAPACITANCE (nF)
TEMPERATURE TRIP THRESHOLD ERROR vs. SERIES RESISTANCE
TEMPERATURE TRIP THRESHOLD ERROR (C)
MAX6511 toc04
TEMPERATURE TRIP THRESHOLD vs. SUPPLY VOLTAGE
TEMPERATURE TRIP THRESHOLD ERROR (C) 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 3.0 3.5 4.0 4.5 5.0 5.5
MAX6511 toc05
1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 0
0.4
20 40 60 80 100 120 140 160 180 200 SERIES RESISTANCE ()
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
3
Low-Cost, Remote SOT Temperature Switches MAX6511/MAX6512/MAX6513
Pin Description
PIN MAX6511 MAX6512 1 2 3 NAME MAX6513 1 2 3 VDD GND HYST Power-Supply Input, +3.0V to +5.5V. Bypass VDD to GND with a 0.1F capacitor. Ground Hysteresis Selection. Hysteresis is 10C for HYST = VDD, 5C for HYST = GND. CMOS Active-Low Output (MAX6511) or Open-Drain Active-Low Output (MAX6512). TOVER goes low when the temperature exceeds the factoryprogrammed temperature threshold. This pin can only sink current in the MAX6512. CMOS Active-High Output (MAX6513). TOVER goes high when the temperature exceeds the factory-programmed temperature threshold. This pin connects to the negative (cathode) terminal of the external P-N sense junction. DXN must be connected to GND. This pin connects to the positive (anode) terminal of the external P-N sense junction. FUNCTION
4
--
TOVER
-- 5 6
4 5 6
TOVER DXN DXP
Detailed Description
The MAX6511/MAX6512/MAX6513 fully integrated temperature switches incorporate a precision bandgap reference, a conversion block, a current source, and a comparator (Figure 1). These devices use an external P-N junction as the temperature-sensing element. They steer bias currents through the external diode, measure the forward voltages, and compute the temperature using a precision chopper stabilized amplifier. Resistance values of less than 100 in series with the external sense junction will result in trip-point errors <1C. The MAX6511/MAX6512/MAX6513 provide noise immunity by integration and oversampling of the diode voltage, but good design practice includes routing the DXP and DXN lines away from noise sources, such as high-speed digital lines, switching regulators, inductors, and transformers. The DXP and DXN traces should be paired together and surrounded by ground plane whenever possible. In applications where the temperature changes rapidly, the measured temperature will be approximately equal to the average value of the temperature during the measurement period.
The MAX6512 has an active-low, open-drain output structure that can only sink current. The MAX6511 has an activelow CMOS output structure, and the MAX6513 has an active-high CMOS output. The MAX6511/MAX6512/MAX6513 are available with preset temperature thresholds from +45C to +125C in 10C increments.
DXP DXN
TEMPERATURE CONVERSION
COMPARATOR
LATCH
TOVER
BANDGAP
VOLTAGE REFERENCE
Figure 1. Functional Block Diagram 4 _______________________________________________________________________________________
Low-Cost, Remote SOT Temperature Switches MAX6511/MAX6512/MAX6513
Table 1. Sensor Transistor Manufacturers
MANUFACTURER Central Semiconductor (USA) ON (USA) Rohm Semiconductor (Japan) Samsung (Korea) Siemens (Germany) Zetex (England) MODEL NUMBER CMPT3904 MMBT3904 SST3904 KST3904-TF SMBT3904 FMMT3904CT-ND
TOVER (MAX6511) TIME TRIP TEMPERATURE TRIP TEMPERATURE HYSTERESIS
Note: Transistors must be diode connected (base shorted to collector).
Figure 2. Temperature Trip Threshold Hysteresis
Hysteresis Input
The HYST pin is a CMOS-compatible input that selects hysteresis at either a high level (10C for HYST = VDD) or a low level (5C for HYST = GND). Hysteresis prevents the output from chattering when the temperature is near the trip point. The HYST pin must not float. The output asserts when the temperature exceeds the trip point and deasserts when the temperature falls back below the trip point minus the hysteresis. For example, if the trip point is 105C, the output will assert at 105C and will not deassert until temperature falls below 105C minus the hysteresis (e.g., 95C if 10C hysteresis is chosen) (Figure 2).
cate the manufacturer has good process controls and that the devices have consistent Vbe characteristics. The MAX6511/MAX6512/MAX6513 can also measure the die temperature of CPUs and other integrated circuits having on-board temperature-sensing diodes. Use the monitor's output to reset the P, assert an interrupt, activate a cooling fan, or trigger an external alarm.
Noise Filtering Capacitors
A quality ceramic capacitor must be connected across the DXP/DXN inputs to maintain temperature threshold accuracy by filtering out noise. The capacitor should be located physically close to the DXP/DXN pins and should typically have a value of 2200pF. Larger capacitor values can cause temperature measurement errors. A 50% variation from the recommended capacitor value can cause up to 1C error.
Applications Information
Remote-Diode Selection
To ensure best accuracy, use a good-quality diodeconnected transistor. Suggested devices are listed in Table 1. Large power transistors are not recommended. Tight specifications for forward current gain indi-
_______________________________________________________________________________________
5
Low-Cost, Remote SOT Temperature Switches MAX6511/MAX6512/MAX6513
Typical Operating Circuit
3.3V VDD P CS DXP DXN HYST MAX6511
2F
TOVER (TO MICROPROCESSOR FAN CONTROLLER, SHUTDOWN, ETC.)
Device Marking Codes for SOT23-6 Package
DEVICE MAX6511UT045 MAX6511UT055 MAX6511UT065 MAX6511UT075 MAX6511UT085 MAX6511UT095 MAX6511UT105 MAX6511UT115 MAX6511UT125 MAX6512UT045 MAX6512UT055 MAX6512UT065 MAX6512UT075 MAX6512UT085 MAX6512UT095 MAX6512UT105 MAX6512UT115 MAX6512UT125 CODE AAOA AAOB AAOC AAOD AAOE AAOF AAOG AAOH AAOI AAOJ AAOK AAOL AAOM AAON AAOO AAOP AAOQ AAOR TEMPERATURE TRIP THRESHOLD (C) 45 55 65 75 85 95 105 115 125 45 55 65 75 85 95 105 115 125 DEVICE MAX6513UT045 MAX6513UT055 MAX6513UT065 MAX6513UT075 MAX6513UT085 MAX6513UT095 MAX6513UT105 MAX6513UT115 MAX6513UT125 MAX6513TT045 MAX6513TT055 MAX6513TT065 MAX6513TT075 MAX6513TT085 MAX6513TT095 MAX6513TT105 MAX6513TT115 MAX6513TT125 CODE AAPD AAPE AAPF AAPG AAPH AAPI AAPJ AAPK AAPL +ACU +ACV +ACW +ACX +ACY +ACZ +ADA +ADB +ADC TEMPERATURE TRIP THRESHOLD (C) 45 55 65 75 85 95 105 115 125 45 55 65 75 85 95 105 115 125
Chip Information
TRANSISTOR COUNT: 3300
6
_______________________________________________________________________________________
Low-Cost, Remote SOT Temperature Switches
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
6LSOT.EPS
MAX6511/MAX6512/MAX6513
_______________________________________________________________________________________
7
Low-Cost, Remote SOT Temperature Switches MAX6511/MAX6512/MAX6513
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
6, 8, &10L, DFN THIN.EPS
2
D2 D A2
N
PIN 1 ID
0.35x0.35 b
PIN 1 INDEX AREA
E DETAIL A
E2 e
[(N/2)-1] x e REF.
A1
k
C L
C L
A
L e e
L
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
1
COMMON DIMENSIONS SYMBOL A D E A1 L k A2 MIN. 0.70 2.90 2.90 0.00 MAX. 0.80 3.10 3.10 0.05
0.20 0.40 0.25 MIN. 0.20 REF.
PACKAGE VARIATIONS PKG. CODE T633-1 T633-2 T833-1 T833-2 T833-3 T1033-1 T1433-1 T1433-2 N 6 6 8 8 8 10 14 14 D2 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.700.10 1.700.10 E2 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 e 0.95 BSC 0.95 BSC 0.65 BSC 0.65 BSC 0.65 BSC 0.50 BSC 0.40 BSC 0.40 BSC JEDEC SPEC MO229 / WEEA MO229 / WEEA MO229 / WEEC MO229 / WEEC MO229 / WEEC MO229 / WEED-3 ------b 0.400.05 0.400.05 0.300.05 0.300.05 0.300.05 0.250.05 0.200.05 0.200.05 [(N/2)-1] x e 1.90 REF 1.90 REF 1.95 REF 1.95 REF 1.95 REF 2.00 REF 2.40 REF 2.40 REF
DOWNBONDS ALLOWED
NO NO NO NO YES NO YES NO
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.


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